3M™ Ultra High Temperature Double Coated Tape 9077, 500 mm x 100 m, 1 Roll/Case

Featuring 3M™ Ultra High Temperature Acrylic Adhesive 100HT, 3M™ Ultra High Temperature Double Coated Tape 9077 is double-coated adhesive transfer tape designed to withstand high temps and still deliver efficient conversion. The 2 mil pressure-sensitive adhesive can withstand temperatures as high as 540°F (280°C) for short periods, suitable for a wide range of processing and operating environments including automotive underhood.

A 3.6 mil release liner resists temps up to 500°F/260°C – excellent for lead-free solder reflow processes commonly used for flexible printed circuit (FPC) attachments. The liner also adds dimensional and structural stability during die-cutting and other conversion processes.

Recommended Applications

Heat sink bonding

3M™ Ultra High Temperature Double Coated Tape 9077 features 3M™ Ultra High Temperature Acrylic Adhesive 100HT, an acrylic adhesive that withstands up to 540°F (280°C) short-term heat resistance and 350°F (175°C) long term temperature tolerance. It delivers much higher adhesion strength at high temperatures than traditional PSA transfer tapes, as well as excellent holding power and low outgassing.

In general, double coated tape is composed of a paper, film, or tissue carrier that is coated on both sides with pressure sensitive adhesive. The adhesive is protected by a peel-away liner that is removed at the time of application. These tapes can be applied by hand or with a dispenser. Double coated tape dispensers are available in a variety of configurations ranging from manual to fully automatic. Applications for double coated tape are found in electronics, automotive, aerospace, general industrial, and fabrication markets.

3M Industrial Adhesives and Tapes Division applies the science of adhesion to deliver innovative solutions that improve the design and manufacturing processes of companies around the world. In the end, these technologies help customers deliver competitive products to the market faster and more efficiently.

• High temperature adhesive and release liner survives short term exposure to 500°F/260°C for lead-free solder reflow
• Maintains high adhesion strength in high temperatures, excellent for heat-intensive processing
• Ideal for flexible printed circuit (FPC) attachments and HSE metals
• High adhesion, excellent holding power and low outgassing